- 題名
- Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
- 創作者：
- John Lau - Unimicron Technology Corporation, Palo Alto, CA, United StatesKuo Ning Chiang - Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan
- 識別碼
- 9819568919; 9819568900; 9789819568918; 9789819568901
- 學術資源類型
- 圖書
- 出版日期
- 2026
- 語言
- 英語
圖書
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
2026
指標
1 檢視次數