Localized sealing schemes for MEMS packaging

Book chapter

Y.T. Cheng, Y.C. Su and Liwei Lin

Mems Packaging, pp.223-249

01/2018

Abstract

Engineering (all)

Environmental Science (all)

1 Record Views

Title: Localized sealing schemes for MEMS packaging
Creators - without role: Y.T. Cheng - Department of Electronics Engineering , National Chiao Tung University , ED640
Y.C. Su - National Tsing Hua University
Liwei Lin - University of California, Berkeley
Identifiers: 9789813229365; 9789813229358; 9957769820306774
Academic Unit: Department of Engineering and System Science, College of Nuclear Science, National Tsing Hua University
Language: English
Resource Type: Book chapter
Publication Details: Mems Packaging, pp.223-249