Abstract
Nanolithography, the patterning of hundreds to thousands of trillions of nano structures on a silicon wafer, determines the direction of futrue nanoelectronics. The technical feasibility and the cost-of-ownership for technologies beyond the mark of 22 nm lines and spaces (half pitch) is evaluated for Extreme-direct-write-on-wafer technology. The 32 nm lithography-of-choice, Double-Patterning, 193 nm Liquid-Immersion Optical Technology (DPT) can possibly be extended to 22 nm with restrictive design patterns and rules, and it serves as a reference for the future candidates.