Thermal Stress-Induced Interfacial Failure Modes of Advanced Electronic Devices

Book chapter

Encyclopedia of Thermal Stresses, pp.5495-5495

01/2014

Abstract

Engineering (all)

Physics and Astronomy (all)

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Title: Thermal Stress-Induced Interfacial Failure Modes of Advanced Electronic Devices
Translated title: Thermal Stress-Induced Interfacial Failure Modes of Advanced Electronic Devices
Creators - without role: Chang-Chun Lee - Chung Yuan Christian University
Kuo-Ning Chiang - Advanced Microsystem Packaging and Nano-Mechanics Research Lab , Department of Power Mechanical Engineering , Advanced Packaging Research Center , National Tsing Hua University
Publication Details: Encyclopedia of Thermal Stresses, pp.5495-5495
Identifiers: 9789400727397; 9789400727380; 9957776257906774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Book chapter