Wafer-level solder bonding by using localized induction heating

Book chapter

Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang

Mems Packaging, pp.197-222

01/2018

Abstract

Engineering (all)

Environmental Science (all)

1 Record Views

Title: Wafer-level solder bonding by using localized induction heating
Creators - without role: Hsueh-An Yang - Department of Power Mechanical Engineering , National Tsing Hua University
Chiung-Wen Lin - Department of Power Mechanical Engineering , National Tsing Hua University
Weileun Fang - Department of Power Mechanical Engineering , National Tsing Hua University
Publication Details: Mems Packaging, pp.197-222
Identifiers: 9789813229365; 9789813229358; 9957773789006774
Academic Unit: Institute of NanoEngineering and Microsystems, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Book chapter