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190 nm excimer laser drilling of glass slices: Dependence of drilling rate and via hole shape on the diameter of the via hole
Conference paper   Peer reviewed

190 nm excimer laser drilling of glass slices: Dependence of drilling rate and via hole shape on the diameter of the via hole

K.H. Chen, Wenhsing Wu, Byung Hwan Chu, C.F. Lo, Jenshan Lin, Y.L. Wang, C.Y. Chang, S.J. Pearton and F. Ren
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol.27(6)
2009

Abstract

Condensed Matter Physics Electrical and Electronic Engineering
The authors have investigated the effect of the via hole diameter on the laser drilling rate of glass as well as the shape of the drilled via holes. An Ar-F 2 based 193 nm UV excimer laser was used in this study. The via holes with a diameter of 120 μm showed a 7.5°-9° angled, tapered side wall, and the drilling rate was relatively constant at around 17 μm/s. For the smaller via holes with diameters ranging from 30-80 μm, significantly different results were obtained due to laser reflection from the tapered side wall of the via hole leading to the drilling rate being slightly increased and via hole becoming conical in shape. For the smallest via holes with an entrance diameter of 10 μm, the resulting hole showed a very high aspect ratio, with a funnel shaped via hole and a significantly reduced drilling rate. © 2009 American Vacuum Society.

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