3D-IC Design and Test

Conference paper

3D-IC Design and Test

J.-F. Li, C.-W. Wu, M. Aoyagi, M.-F. Chang and D.-M. Kwai

Proc. 31st IEEE VLSI Test Symp. (VTS) (Special Session 4C: Hot Topic)

04/2013

Abstract

3D;IC design

Electrical Engineering

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Title: 3D-IC Design and Test
Creators - without role: J.-F. Li
C.-W. Wu
M. Aoyagi
M.-F. Chang
D.-M. Kwai
Publication Details: Proc. 31st IEEE VLSI Test Symp. (VTS) (Special Session 4C: Hot Topic)
Identifiers: 9957769886706774
Academic Unit: College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper