Abstract
Fabricating smooth, round structures in silicon is challenging by conventional processing methods. In this paper, we report on a novel 3D shaping technique for producing microspheres, microdisk toroids, submicron wires, and circular beams in Si using hydrogen annealing. Microspheres with 1 μm radius, submicron wires with 0.5 μm radius, and a microdisk toroid with 0.2 μm toroidal radius have been successfully demonstrated.