3D Stack Ultra High Resistance Via Matrix by Cu BEOL Structures in Nano-scaled CMOS Processing Node

Conference paper

Li-Yu Yeh, Ya-Lin Chang, Yue-Der Chih, Jonathan Chang, 崇榮林 and Ya-Chin King

2023 International Conference on Solid State Devices and Materials

09/2023

Abstract

3D Stack;Cu;CMOS Processing Node

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Title: 3D Stack Ultra High Resistance Via Matrix by Cu BEOL Structures in Nano-scaled CMOS Processing Node
Creators - without role: Li-Yu Yeh
Ya-Lin Chang
Yue-Der Chih
Jonathan Chang
崇榮林
Ya-Chin King
Identifiers: 9957769799406774
Academic Unit: Institute of Electronics Engineering, College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: English
Resource Type: Conference paper
Publication Details: 2023 International Conference on Solid State Devices and Materials