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3D Stack Ultra High Resistance Via Matrix by Cu BEOL Structures in Nano-scaled CMOS Processing Node
會議論文

3D Stack Ultra High Resistance Via Matrix by Cu BEOL Structures in Nano-scaled CMOS Processing Node

Li-Yu Yeh, Ya-Lin Chang, Yue-Der Chih, Jonathan Chang, Chrong-Jung Lin 和 雅琴 金
2023 International Conference on Solid State Devices and Materials (SSDM)
09/2023

摘要

3D Stack Ultra High Resistance;Cu BEOL Structures;Nano-scaled CMOS

相關連結

指標

1 檢視次數

詳細資料

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