Abstract
4H-SiC BJTs with 1.05 mm <sub>2</sub> and 0.0072 mm <sup>2</sup> active areas are fabricated. Large devices show specific on-state resistance R <sub>ON,SP</sub> of 78 mΩ-cm <sup>2</sup> , common emitter current gain β of 15, and open-base blocking voltage BV <sub>CEO</sub> > 3,200 V at room temperature. Small devices have β around 20, and R <sub>ON,SP</sub> of 28 mΩ-cm <sup>2</sup> . R <sub>ON,SP</sub> increases with temperature while β decreases. β also decreases as the spacing between base contact implant and emitter finger is reduced. We attribute this to recombination in the p+ implanted base contact at implant-induced defect sites.