- Title
- 5 nm-Thick (AlCrTaTiZrRu)N0.5 Multi-component Barrier Layer with High Diffusion Resistance for Cu Interconnects
- Creators - without role
- Yi-Chung HuangChen-Yuan WangShou-Yi Chang - 國立清華大學工學院材料科學工程學系
- Publication Details
- Proceedings of ThinFilms 2010 Proceedings of ThinFilms 2010
- Identifiers
- 9957773407706774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
5 nm-Thick (AlCrTaTiZrRu)N0.5 Multi-component Barrier Layer with High Diffusion Resistance for Cu Interconnects
Proceedings of ThinFilms 2010 Proceedings of ThinFilms 2010
2010
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