- Title
- A Bearing Model of Relative Motion between Wafer and Abrasives in Chemical Mechanical Planarization
- Creators - without role
- 宏營 蔡
- Publication Details
- Proceedings of 1998 International Conference on Mechatronic Technology
- Identifiers
- 9957769897706774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- English
- Resource Type
- Conference paper
Conference paper
A Bearing Model of Relative Motion between Wafer and Abrasives in Chemical Mechanical Planarization
Proceedings of 1998 International Conference on Mechatronic Technology
1998
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