- Title
- A Hybrid Multi-objective Genetic Algorithm Combined with Dispatching Rule for Wafer Test Scheduling
- Creators - without role
- Chun-An Chen宏鍇 王Chia-Le Wu
- Publication Details
- 2023 the 3rd International Conference on Smart Manufacturing, Industrial & Logistics Engineering
- Grant note
- 國科會
- Identifiers
- 9957767711906774
- Academic Unit
- Executive Cross-Discipline Master Program for Intelligent Manufacturing, Office of Academic Affairs, National Tsing Hua University
- Language
- English
- Resource Type
- Conference paper
Conference paper
A Hybrid Multi-objective Genetic Algorithm Combined with Dispatching Rule for Wafer Test Scheduling
2023 the 3rd International Conference on Smart Manufacturing, Industrial & Logistics Engineering
2023
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