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A New Ultra-Low Voltage Metal Fuse for High Density OTP Applications
會議論文

A New Ultra-Low Voltage Metal Fuse for High Density OTP Applications

Li-Yu Wang, Kuan-Ju Chen, Perng-Fei Yuh, Yih Wang, Jonathan Chang, Ya-Chin King 和 Chrong Jung Lin
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
IEEE
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) (HsinChu, Taiwan, 22/04/2024–25/04/2024)
22/04/2024
Web of Science ID: WOS:001253001400010

摘要

Fuses Technological innovation Temperature distribution Three-dimensional displays Computer Architecture Geometry Microprocessors
This paper presents an innovation in Metal-Fuse one-time-programmable (OTP) memory cell and technology, introducing a novel 1T2R bit cell structure that operates at an ultra-low program voltage. A Current-Divider Via (CDV) technique effectively divides the program current, leading to a significant reduction in the size of the select transistor. Additionally, the proposed OTP memory with an optimized fuse geometry shows a remarkably low program voltage of only 1.2 V and an impressive read window exceeding 5× 10³ .

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