摘要
With the rise of AI, HPC, 5G, and optoelectronic integration, demand for high-density multi-die packaging is increasing. Traditional 2.5D/3D solutions face warpage, reliability, and yield issues as interposer size grows. We developed a novel fan-out wafer module stacking technology using transfer bonding to reduce thermal/mechanical stress and enhance reliability. The process includes RDL formation, Cu pillar interconnection, low-temperature polymer/Cu hybrid bonding, and temporary carrier removal. Demonstrations showcase defect-free fine-line RDL, strong multi-die bonding, controlled warpage, and robust structural integrity. This technology enables high-density multi-die integration with improved warpage suppression and reliability, offering a viable solution for advanced heterogeneous integration packaging.