A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects

Y.H. Lin; C.C. Lee; C.Y. Liao; M.H. Lin; W.C. Tu; Robin Chen; H.P. Chen; Winston S. Shue; Min Cao

doi:10.1109/IRPS48203.2023.10117795

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Conference paper

A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects

Y.H. Lin, C.C. Lee, C.Y. Liao, M.H. Lin, W.C. Tu, Robin Chen, H.P. Chen, Winston S. Shue and Min Cao

IEEE International Reliability Physics Symposium Proceedings, Vol.2023-March

2023

DOI: https://doi.org/10.1109/IRPS48203.2023.10117795

Appears in keyword about Physics

Abstract

BEOL

Equivalent material method

FEA

Process-oriented simulation

warpage prediction

Engineering (all)

Process-induced warpage caused by high-density interconnects in the back-end of line (BEOL) structure, may affect the performance and the reliability of the product during the packaging process. In this paper, a BEOL structure is used to develop a process-oriented simulation methodology to optimize the design and predict warpage. To reduce simulation time and obtain accurate predictions, the equivalent material method and equivalent residual stress are used in our proposed method. The layer-by-layer warpage predictions matched the measurement data.

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Title: A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects
Translated title: A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects
Creators - without role: Y.H. Lin - National Tsing Hua University
C.C. Lee - National Tsing Hua University
C.Y. Liao - Taiwan Semiconductor Manufacturing Company (Taiwan)
M.H. Lin - Taiwan Semiconductor Manufacturing Company (Taiwan)
W.C. Tu - Taiwan Semiconductor Manufacturing Company (Taiwan)
Robin Chen - Taiwan Semiconductor Manufacturing Company (Taiwan)
H.P. Chen - Taiwan Semiconductor Manufacturing Company (Taiwan)
Winston S. Shue - Taiwan Semiconductor Manufacturing Company (Taiwan)
Min Cao - Taiwan Semiconductor Manufacturing Company (Taiwan)
Publication Details: IEEE International Reliability Physics Symposium Proceedings, Vol.2023-March
Identifiers: 9781665456722; 9957771554906774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Conference paper

A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects

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