A Patch Clamp Chip Featuring High Giga-Ohm Seal Yields and Microfluidic Exchange of Solutions

Conference paper

C. Chen, N. Li and A. Folch

Annual fall meeting of the Biomedical Engineering Society Annual fall meeting of the Biomedical Engineering Society

2006

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Title: A Patch Clamp Chip Featuring High Giga-Ohm Seal Yields and Microfluidic Exchange of Solutions
Creators - without role: C. Chen - 國立清華大學工學院動力機械工程學系
N. Li
A. Folch
Identifiers: 9957771196806774
Academic Unit: Institute of NanoEngineering and Microsystems, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Annual fall meeting of the Biomedical Engineering Society Annual fall meeting of the Biomedical Engineering Society