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A STEP-COMPATIBLE APPROACH for IC PACKAGING SCHEDULING SYSTEM
Conference paper

A STEP-COMPATIBLE APPROACH for IC PACKAGING SCHEDULING SYSTEM

Thu-Hua Liu, Amy J.C. Trappey and Fu-Wei Chan
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), Vol.1996-T, pp.633-648
1996

Abstract

STEP Mechanical Engineering

This research develops a Computer-Aided Scheduling System (CASS) for IC packaging industry. We adopt the concept and methods of STEP enabling technologies to model and implement the system. The effort aims to achieve integration of engineering applications by standardizing the modeling and the use of product data. This paper uses IDEFO to model the IC packaging scheduling process and, then, EXPRESS language to define the data models. The IC packaging scheduling system is implemented in an integrated environment using the object-oriented language (C++) and the object-oriented database (Objectstore). The ST-Developer is used as the kernel to interface the application language, the database, and the EXPRESS data models. The architecture of this integrated implementation environment is not only effective for scheduling task but also useful in general applications for product design, analysis and production plarming.

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