- Title
- A Study of Eutectic Sn-Pb Solder Wetting Behavior on Cu Strips Under Thermal Stressing
- Creators - without role
- C. N. Liao - 國立清華大學工學院材料科學工程學系W. T. Chen
- Publication Details
- TMS 133rd Annual Meeting & Exhibition
- Identifiers
- 9957772144206774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
A Study of Eutectic Sn-Pb Solder Wetting Behavior on Cu Strips Under Thermal Stressing
TMS 133rd Annual Meeting & Exhibition
2004
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