A Two-dimensional Cutting Procedure for Optimizing the Wafer Exposure Pattern

Conference paper

Chen-Fu Chien, J. Deng and A. Shyu

15th Triennial Conference of IFORS 15th Triennial Conference of IFORS

1999

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Title: A Two-dimensional Cutting Procedure for Optimizing the Wafer Exposure Pattern
Creators - without role: Chen-Fu Chien - 國立清華大學工學院工業工程與工程管理學系
J. Deng
A. Shyu
Publication Details: 15th Triennial Conference of IFORS 15th Triennial Conference of IFORS
Identifiers: 9957766559406774
Academic Unit: Department of Industrial Engineering and Engineering Management, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper