Abstract
For the first time, growth of high-quality Ge-rich Ge 1-x Si x (0≤x≤0.14) layers on Ge substrate was demonstrated. An effective suppression of the phosphorus diffusion in Ge 1-x Si x and a better thermal stability of the nickel germanide on Ge 1-x Si x were observed. A higher rectifying ratio with a reduced diode leakage current in n + -Ge 1-x Si x /p-Ge1-xSix is compared with n + -Ge/p-Ge. These results indicate that it is suitable for Ge 1-x Si x to be used as source/drain (S/D) to fabricate the uniaxial tensile-strained channel Ge nMOSFETs. © 2009 IEEE.