Abstract
This research proposes a decision framework of analyzing the inspection frequency of the equipment for the advanced wafer bumping process. Wafer bumping process is the front-end process prior to flip chip assembly. Wafers from front-end fab are processed in bumping houses and further sent to assembly houses for packaging. Owing to the high value of the bumped wafer, the stability of the equipment is requested extremely. Therefore, how to decide the efficient inspection frequency to meet the requirement of mass production but not to lose the quality of the products is a critical issue. In the study, a lot of historical data is analyzed by applying Binomial statistic distribution and further the risk analysis is constructed to decide the most proper inspection frequency under considering the relation between profits and lost. Finally, an empirical study was conducted in a bumping house and the results showed its practical viability.