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A highly scalable poly-Si junctionless FETs featuring a novel multi-stacking hybrid P/N layer and vertical gate with very high Ion/Ioff for 3D stacked ICs
Conference paper

A highly scalable poly-Si junctionless FETs featuring a novel multi-stacking hybrid P/N layer and vertical gate with very high Ion/Ioff for 3D stacked ICs

Ya-Chi Cheng, Hung-Bin Chen, Chun-Yen Chang, Chun-Hu Cheng, Yi-Jia Shih and Yung-Chun Wu
Digest of Technical Papers - Symposium on VLSI Technology, Vol.2016-September, 7573429
21/09/2016

Abstract

This work demonstrates for the first time a three-dimensional (3D) stacked hybrid P/N layer for p-channel junctionless thin-film transistor (JL-TFT) with nanowire (NW) structures. Relative to conventional stacked devices, the 3D stacked hybrid P/N JL-TFT exhibits a high I <sub>on</sub> /I <sub>off</sub> current ratio (>10 <sup>9</sup> ), a steep subthreshold swing (SS) of 70 mV/dec, a low drain-induced barrier lowering (DIBL) value of 3.5 mV/V; these properties are achieved by reducing the effective channel thickness that is determined by the channel/substrate junction. The developed stacked hybrid P/N exhibits reduced low-frequency noise, less sensitive temperature coefficients and performance variation in both threshold voltage (V <sub>th</sub> ) and SS, and so is suit for high-density 3D stacked integrated circuit (IC) applications.

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