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A low-cost broadband bondwire interconnect for THz heterogeneous system integration
Conference paper

A low-cost broadband bondwire interconnect for THz heterogeneous system integration

Chun-Hsing Li, Chih-Wei Lai, Tzu-Chao Yan and Chien-Nan Kuo
2015 IEEE MTT-S International Microwave Symposium, IMS 2015, 7166852
07/2015
DOI: https://doi.org/10.1109/MWSYM.2015.7166852

Abstract

Bondwire broadband heterogeneous integration interconnect THz Computer Networks and Communications Signal Processing Electrical and Electronic Engineering
A low-cost broadband bondwire interconnect is proposed for THz heterogeneous system integration. A transversal path composed of two transmission lines and a bondwire is introduced to effectively reduce the bondwire effect of an original signal path consisted of a single bondwire only. Simulation results indicate that the return loss and insertion loss can be better than 15 dB and 2.3 dB from dc to 456 GHz, respectively. Measured interconnect loss is around 0 dB to 1.5 dB from 320 to 340 GHz.

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