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A monolithic 3D fully-differential CMOS accelerometer
Conference paper

A monolithic 3D fully-differential CMOS accelerometer

Ming-Han Tsai, Chih-Ming Sun, Chuanwei Wang, Jrhoung Lu and Weileun Fang
3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS, pp.1067-1070
2008

Abstract

3D Accelerometer CMOS Fully-differential
This study presents a novel inertia sensor design to monolithic integrate x, y, and z-axis accelerometers on a single chip. The chip is implemented using the TSMC 0.35μm 2P4M CMOS process, and post metal wet-etching and dielectric dry-etching processes. Thus, the fully-differential capacitance sensing in-plane and out-plane CMOS accelerometers are realized. The measurement results demonstrate the sensitivities for in-plane and out-of-plane accelerometers are 3.9mV/G and 0.9mV/G, respectively. The coupling ratios for in-plane and out-plane accelerometer are 3∼5% and 15∼30%, respectively. © 2008 IEEE.

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