Abstract
The authors describe a novel accurate model and a numerical analysis of hot electron injection into the gate oxide of submicron MOSFETs in the low applied voltage region (V <sub>GS</sub> <5 V, V <sub>DS</sub> <3 V). The model quantitatively takes into account both the Auger recombination process and the phonon assist process. Calculated results agree with experimental results in the measured range of 2.3 V<V <sub>DS</sub> <2.7 V and 2.5 V<V <sub>GS</sub> <4.1 V. This agreement strongly indicates that the new model can give an accurate understanding of the injection mechanism, and successfully explains the low voltage hot electron phenomena.