Abstract
FET devices are extensively used for sensors, including gas sensors and biosensors. In contrast to traditional resistive devices, FET has transconductance gain, which can significantly improve the S/N ratio. Recently, more applications in biosensors combine microfluidic channels and FET system. In FET-based biosensors, the wafer manufacturing process always requires a lot of cost, and it is used for metal lines as interconnects. Miniaturized chip plays a key role in reducing the manufacturing cost. However, simultaneously integrating the sensor and microfluidic channels on one chip is challenging. In this study, a novel and robust packaging method has been developed, to effectively reduce the size of the sensor chip and thereby the cost. 1 mm 2 FET sensor chip has been fabricated and embedded in epoxy. Photolithography and metal deposition were done followed by lift-off process for metal interconnect. The FET-embedded chip was passivated and covered by the microfluidic channel made of PMMA.