- Title
- A novel approach to enhancing the polishing process of InP or GaSb-based wafer substrates for large-scale manufacturing
- Creators - without role
- F. ShiK.Y. ChengK.C. Hsieh
- Identifiers
- 9957770058906774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- 2003 Electronic Materials Conference
Conference paper
A novel approach to enhancing the polishing process of InP or GaSb-based wafer substrates for large-scale manufacturing
2003 Electronic Materials Conference
2003
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