Abstract
By applying the etching via technology, this study proposes a novel front-side etching fabrication process for a silicon based piezoresistive pressure sensor to replace the conventional backside bulk micro-machining. The distinguishing features of this novel structure are chip size reduction and fabrication costs degradation. In order to investigate the sensor performance and the sensor packaging effect of the structure proposed in this research, the finite element method was adopted for analyzing the sensor sensitivity and stability. The sensitivity and the stability of the novel sensor after packaging were studied by applying mechanical as well as thermal loading to the sensor. Furthermore, the fabrication process and the sensor performance of the novel pressure sensor were compared with the conventional back-side etching type pressure sensor for the feasibility validation of the novel sensor. The results showed that the novel pressure sensor provides better sensitivity than the conventional one, and the sensor output signal stability can be enhanced by better packaging structure designs proposed in this study. Based on the above findings, this novel structure pressure sensor shows a high potential for membrane type micro-sensor application.