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A precision alignment method to 〈100〉 Direction on (110) silicon wafer
Conference paper

A precision alignment method to 〈100〉 Direction on (110) silicon wafer

Fan-Gang Tseng and Kai-Chen Chang
American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS), Vol.3, pp.403-406
2001

Abstract

This paper proposes a novel pre-etch method to determine the 〈100〉 direction on (110) silicon wafers for bulk etching. Series of circular windows were arranged in an arc of radius 48.9 mm, and bulk-etched to form hexagonal shapes for crystal orientation finding. The corners of the hexagons can be used as an alignment reference for the indication of the 〈100〉 direction on (110) silicon wafers. This innovative approach has been demonstrated experimentally to give an orientation-alignment accuracy of ± 0.03° for (110) wafers with 4-inch diameter.

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