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A robust and reliable stress-induced self-assembly mechanism for optical devices
Conference paper

A robust and reliable stress-induced self-assembly mechanism for optical devices

Yi-Ping Ho, Mingching Wu, Hung-Yi Lin and Weileun Fang
2002 IEEE/LEOS International Conference on Optical MEMs, OMEMS 2002 - Conference Digest, pp.131-132
2002
DOI: https://doi.org/10.1109/OMEMS.2002.1031478

Abstract

Hardware and Architecture Control and Systems Engineering Electrical and Electronic Engineering Electronic Optical and Magnetic Materials
Based on the MUMPs platform, this study has established an improved surface micromachining process (MUMPs-like process) to improve the reliability of the stress-induced beams. A novel rigid supporting mechanism is devised to prevent the mirror from offset. Furthermore, with this mechanism various pop-up mirrors could be accomplished. According to this MUMPs-like process, devices are fabricated to evaluate the performance of this assembly mechanism.

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