Abstract
We developed a strong bonding of glass nanofluidic chips at room temperature (RT) in ambient air, overcoming the strict requirements for glass fusion bonding conventionally performed at extremely high temperature (∼1,000 °C) in vacuum.
- Title
- A room-temperature bonding of glass nanofluidic chips utilizing a surface activation with a fluorine-containing plasma treatment
- Translated title
- A room-temperature bonding of glass nanofluidic chips utilizing a surface activation with a fluorine-containing plasma treatment
- Creators - without role
- Yan Xu - Osaka Prefecture UniversityChenxi Wang - Department of Applied Chemistry, School of Engineering, University of TokyoKihoon Jang - Department of Applied Chemistry, School of Engineering, University of TokyoLixiao Li - Department of Applied Chemistry, School of Engineering, University of TokyoNobuhiro Matsumoto - Osaka Prefecture UniversityYiyang Dong - Department of Applied Chemistry, School of Engineering, University of TokyoKazuma Mawatari - Department of Applied Chemistry, School of Engineering, University of TokyoTadatomo Suga - Department of Applied Chemistry, School of Engineering, University of TokyoTakehiko Kitamori - Department of Applied Chemistry, School of Engineering, University of Tokyo
- Publication Details
- Proceedings of the 16th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2012, pp.1225-1227
- Identifiers
- 9780979806452; 9957771512106774
- Academic Unit
- Institute of NanoEngineering and Microsystems, College of Engineering, National Tsing Hua University
- Language
- English
- Resource Type
- Conference paper