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A single-layer step-bridge for out-of-plane thermal actuator
Conference paper

A single-layer step-bridge for out-of-plane thermal actuator

Po-I Yeh, Wen-Chih Chen, Chih-Fan Hu and Weileun Fang
TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems, pp.2175-2178
2007

Abstract

MEMS Out-of-plane Step-bridge Thermal actuator
This study presents the design and fabrication of a single-layer out-of-plane thermal actuator. The step-bridge structure design enables the actuator bent and then buckled in the out-of-plane direction by Joule-heating. In summary, the step-bridge actuator design has five merits: (1)The linear load-deflection relation is achieved, (2)The bi-stable buckling behavior is prevented, (3)The unwanted vibration modes can be suppressed, (4)The delamination problem is prevented, and (5)The bridge structure is stiffer and more stable. The actuator and its application on a lens positioning stage have been implemented using p ++ Si layer by bulk micromachining. ©2007 IEEE.

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