A study of atomic-scale copper electromigration by in-situ transmission electron microscopy

Conference paper

C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu

2008 International Symposium on Materials for Enabling Nanodevices

2008

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Title: A study of atomic-scale copper electromigration by in-situ transmission electron microscopy
Creators - without role: C. N. Liao - 國立清華大學工學院材料科學工程學系
K. C. Chen
W. W. Wu
L. J. Chen
K. N. Tu
Publication Details: 2008 International Symposium on Materials for Enabling Nanodevices
Identifiers: 9957769297806774
Academic Unit: Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper