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Adhesion Investigation of Low-k Films System Using 4-Point Bending Test
Conference paper

Adhesion Investigation of Low-k Films System Using 4-Point Bending Test

W. C. Wang, C. C. Lee, J. Huang and S. T. Chang
4th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms 2008) 4th International Conference on Technological Advances of Thin Films & Surface Coatings (ThinFilms 2008)
2008

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