Abstract
The growth of the intermetallic compounds (IMC) layer and the shear-strength degradation of the eutectic Sn-Pb solder that was reflowed on a Cu pad with an Au/Ni metallization during aging at 150°C was examined. It was shown that first two IMC layers, Au 0.5 Ni 0.5 Sn 4 and Ni 3 Sn 4 , were observed at the solder/Ni interface after 150°C isothermal-aging treatment over 720 h. The Ni 3 Sn 4 layer was observed at the solder/Ni interface and the Au 0.5 Ni 0.5 Sn 4 layer was found at the solder/Ni 3 Sn 4 interface. Au 0.5 Ni 0.5 Sn 4 layer grows with time and dominates the thickness of the IMC layer.