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An ultra-low power ovenized CMOS-MEMS resonator monolithically integrated with interface circuits
Conference paper

An ultra-low power ovenized CMOS-MEMS resonator monolithically integrated with interface circuits

Ming-Huang Li, Ming-Huang Li, Cheng-Syun Li, Chi-Hang Chin, Chao-Yu Chen and Sheng-Shian Li
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp.753-756
2013

Abstract

Logic circuits;Low power electronics;Microelectromechanical devices;Micromechanical resonators;Monolithic integrated circuits;Ovens;Serpentine;Structural design Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Electronic,Optical and Magnetic Materials
This work reports on the design, fabrication, and characterization of the first CMOS-MEMS ovenized micromechanical resonator monolithically integrated with interface circuits while attaining a 100°C effective temperature rise under heating power in a sub-mW range. The key to attaining such low heater power consumption (i.e., high heating efficiency) relies on the combination of low thermal-conductivity nature of constituent materials and high thermal-isolation structural design. The serpentine-shaped heater structure consists of thick SiO 2 structural layer and thin polysilicon heater, hence offering very high thermal resistance well suited for low power operation. An arrayed free-free beam oxide resonator is placed near the heater and operated in a typical two-port configuration to serve as an ovenized resonant tank. Furthermore, with 2-mW heating power, the heater structure generates visible light, exhibiting its temperature greater than 1000°C and verifying the superior thermal isolation using CMOS-MEMS technology. © 2013 IEEE.

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