- Title
- Analyses of Interface Adhesion between Cu and SiCN Etch Stop Layers by Nanoindentation and Nanoscratch Tests
- Creators - without role
- Shou-Yi Chang - 國立清華大學工學院材料科學工程學系Yu-Shuien Lee
- Publication Details
- Proceedings of 2006 International Conference on Solid State Devices and Materials Proceedings of 2006 International Conference on Solid State Devices and Materials (SSDM 2006), pp.472-473
- Identifiers
- 9957770023606774
- Academic Unit
- Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Analyses of Interface Adhesion between Cu and SiCN Etch Stop Layers by Nanoindentation and Nanoscratch Tests
Proceedings of 2006 International Conference on Solid State Devices and Materials Proceedings of 2006 International Conference on Solid State Devices and Materials (SSDM 2006), pp.472-473
2006
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