Analyses of Interface Adhesion between Porous SiOCH Low-k Film and SiCN Layers by Nanoindentation and Nanoscratch Tests

Conference paper

Proceedings of ThinFilms 2006 Proceedings of ThinFilms 2006

2006

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Title: Analyses of Interface Adhesion between Porous SiOCH Low-k Film and SiCN Layers by Nanoindentation and Nanoscratch Tests
Creators - without role: Shou-Yi Chang - 國立清華大學工學院材料科學工程學系
Jien-Yi Chang
Su-Jien Lin
Identifiers: 9957775749106774
Academic Unit: Department of Materials Science and Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: Proceedings of ThinFilms 2006 Proceedings of ThinFilms 2006