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Analysis and Investigation of Material Equivalent Mechanics-Based Simulated Approach on Three-Dimensional Chip Stacking Structure
Conference paper

Analysis and Investigation of Material Equivalent Mechanics-Based Simulated Approach on Three-Dimensional Chip Stacking Structure

C. C. Lee, B. T. Chian, Y. Y. Liou and H. N. Liu
Proceedings of the 39th Conference on Theoretical and Applied Mechanics Proceedings of the 39th Conference on Theoretical and Applied Mechanics
2015

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