- 題名
- Analyzing plating thickness distribution in PCB manufacturing: A global/local simulation approach for copper plating processes
- 創作者：
- Dun-Yi Ke (作者)Yuan Yao - 國立清華大學, 化學工程學系
- 會議
- 11th Asian Symposium on Process Systems Engineering (PSE Asia 2024) (Penang, Malaysia, 05/08/2024–08/08/2024)
- 學術資源類型
- 會議論文
會議論文
Analyzing plating thickness distribution in PCB manufacturing: A global/local simulation approach for copper plating processes
11th Asian Symposium on Process Systems Engineering (PSE Asia 2024) (Penang, Malaysia, 05/08/2024–08/08/2024)
指標
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