Abstract
The Mold Controlled Profile (MCP) technique consists of coating a layer of immiscible polymer over a pre-patterned resist image. This structure can be heated to an extremely high temperature without lateral distortion of the original resist profile, while the patterned resist undergoes significant chemical changes. After removal of the mold, the resultant image can be used in many areas of application. Here, the hardening aspect and the compensation of inter-facial layer in the capped deep-uv Portable Con-formable Masking (PCM) system are given to demonstrate the advantages of the MCP technique and to stimulate other new applications. © 1987 SPIE.