Approaches toward Improvement of Stress-Induced Voiding in Advanced Interconnect Technologies

Conference paper

C. C. Lee, W. C. Wang, T. L. Tzeng and W. L. Huang

TACT 2013 International Thin Films Conference TACT 2013 International Thin Films Conference

2013

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Title: Approaches toward Improvement of Stress-Induced Voiding in Advanced Interconnect Technologies
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
W. C. Wang
T. L. Tzeng
W. L. Huang
Identifiers: 9957770785706774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: TACT 2013 International Thin Films Conference TACT 2013 International Thin Films Conference