Assembly Reliability Improvement of 3D-ICs Packaging Using Pre-Stuffed Molding Material

Conference paper

C. C. Lee, Y. H. Guo, Y. M. Lin, C. J. Zhan and T. C. Chang

3rd International Symposium on Next-Generation Electronics (ISNE 2014) 3rd International Symposium on Next-Generation Electronics (ISNE 2014)

2014

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Title: Assembly Reliability Improvement of 3D-ICs Packaging Using Pre-Stuffed Molding Material
Creators - without role: C. C. Lee - 國立清華大學工學院動力機械工程學系
Y. H. Guo
Y. M. Lin
C. J. Zhan
T. C. Chang
Identifiers: 9957770231306774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper
Publication Details: 3rd International Symposium on Next-Generation Electronics (ISNE 2014) 3rd International Symposium on Next-Generation Electronics (ISNE 2014)