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Automated dual-probing system for wafer-level testing based on the integration of visual identification and laser sensing
Conference paper

Automated dual-probing system for wafer-level testing based on the integration of visual identification and laser sensing

Ya-Ting Huang and Rongshun Chen
Proceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018, pp.101-104
01/2019
DOI: https://doi.org/10.1109/AMCON.2018.8614880

Abstract

Automated dual-probing system MEMS measurement MEMS wafer test Biomedical Engineering Mechanics of Materials Safety Risk Reliability and Quality Management Monitoring Policy and Law Education Fluid Flow and Transfer Processes Industrial and Manufacturing Engineering
This study develops an automated wafer-level testing system, using visual and laser as the sensing devices, which can be the platform of MEMS measurement at wafer level. The proposed system involves the development of human-machine interface and precisely positioning control, which includes camera module for visual identification, motorized micro positioners, laser sensors for probe positioning automated, and wafer movable stage for the wafer positioning.

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