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Bandwidth and SNR enhancement of MEMS microphones using two poly-Si micromachining processes
Conference paper

Bandwidth and SNR enhancement of MEMS microphones using two poly-Si micromachining processes

Sung-Cheng Lo, Sheng-Kai Yeh, Jhih-Jhe Wang, Mingching Wu, Rongshun Chen and Weileun Fang
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Vol.2018-January, pp.1064-1067
04/2018

Abstract

Electronic Optical and Magnetic Materials Condensed Matter Physics Mechanical Engineering Electrical and Electronic Engineering
This study employs the MOSBE process [1] to design and implement the MEMS microphone in Fig.1a to improve the signal-to-noise ratio (SNR) and the sensing range. The microphone has three merits: (1) rigid diaphragm without released holes together with ring-type oxide/polySi mesa could reduce the low frequency acoustic loss (Fig. lb); (2) rigid diaphragm supported by flexible V-shaped springs enables the parallel plate gap-closing capacitance sensing to improve sensing area and sensitivity (Fig.1b); (3) silicon nitride electrical isolation increases the sensing area to improve initial capacitance and noise floor (Fig.1c). Measurements indicate the fabricated microphone of 800μm diameter diaphragm: acoustic sensitivity is -39.8dB (Ref: 1V/1Pa) at 1kHz; +3dB bandwidth ranges 50-22kHz; and the SNR is over 54dB. Comparing with [2-3] in Table1, the presented microphone significantly improves the performances.

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