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CMOS THz transmissive imaging system
Conference paper

CMOS THz transmissive imaging system

Tzu-Chao Yan, Chun-Hsing Li, Chih-Wei Lai, Wei-Cheng Chen, Tzu-Yuan Chao and Chien-Nan Kuo
Proceedings - 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC 2014, pp.169-172
01/2015

Abstract

CMOS signal sensor signal source System-on-Package (SoP) THz imaging system Electrical and Electronic Engineering Hardware and Architecture
This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology. The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 μm CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm.

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