- Title
- Characteristics of SnAg3.0Cu0.5 Flip Chip Solder Bump Electromigration
- Creators - without role
- Chien Chen LeeK. M. ChenChang Chun Lee - 國立清華大學工學院動力機械工程學系C. C. ChiuF. KuoK. N. Chiang
- Identifiers
- 9957770642506774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- IEEE 56th Electronic Components and Technology Conference (56th ECTC) IEEE 56th Electronic Components and Technology Conference (56th ECTC), pp.1164-1169
Conference paper
Characteristics of SnAg3.0Cu0.5 Flip Chip Solder Bump Electromigration
IEEE 56th Electronic Components and Technology Conference (56th ECTC) IEEE 56th Electronic Components and Technology Conference (56th ECTC), pp.1164-1169
2006
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