- Title
- Characterization of Bi-33In Low Temperature Solder with Cu UBM
- Creators - without role
- R. W. SongJ. G. Duh - 國立清華大學工學院材料科學工程學系
- Publication Details
- Materials Science & Technology 2016 Materials Science & Technology 2016
- Identifiers
- 9957775475606774
- Academic Unit
- National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Characterization of Bi-33In Low Temperature Solder with Cu UBM
Materials Science & Technology 2016 Materials Science & Technology 2016
2016
Metrics
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